899 MAD
ARCTIC Freezer Duo 34 Air Cooler
899 MAD
- LGA1700 COMPATIBILITY: The ARCTIC Freezer Duo 34 is compatible with Intel’s new Alder Lake processors – Socket LGA1700
- IMPROVED HEAT DISSIPATION: Evenly spread direct-touch heat pipes and an optimized heat sink design with 54 cooling fins lead to ideal heat dissipation for the Freezer 34 eSports DUO
- FOR HIGH-END CPU: The contact surface of the Freezer 34 eSports DUO heat pipes does not cover the full heat spreader but is right where the processor DIE is and covers even the largest versions (18 core)
- EASY INSTALLATION & SECURE HOLD: Fast and easy to install, the mounting system of the Freezer 34 eSports DUO is compatible with Intel and AMD sockets, thanks to a backplate and its low weight it’s also transport-safe
- IDEAL AIRFLOW: The two BioniX P-fans of the Freezer 34 eSports DUO work in push-pull-mode, and the resulting increase of airflow ensures that the heat from the CPU is dissipated even faster
125 MAD
Thermal Paste Grizzly Hydronaut 1G
125 MAD
- ULTIMATE OVERCLOCKING PERFORMANCE – With its outstanding thermal conductivity, Hydronaut can handle overclocking, making it perfect for users with large heatsinks seeking a high-quality product at an attractive price-performance ratio, such as for their water cooling system
- PRECISE APPLICATION – The practical syringe allows for easy application of this thermal paste, delivering it exactly where it needs to be. Ideal for CPU and cooling, GPU, LEDs, and heat sink fins
- PERFECT HEAT CONDUCTION – Provides awless heat transfer without integration into the processor. Thermal conductivity of 11.8 W/mK; thermal resistance of 0.0076 K/W
- VERSATILE COMPATIBILITY – Compatible not only with computers or laptops but also with PS 3, 4, 5, Xbox 360, One, and Series X consoles! Perfectly dissipates heat from MacBooks
- LONG-LASTING STABILITY – Hydronaut thermal paste does not harden and has high long-term stability. It does not require a hardener, contains no silicone, and is non-conductive
640 MAD
ARCTIC Freezer i35 A-RGB Air Cooler
640 MAD
- HIGH PERFORMANCE FOR HIGH-END CPUs: With its 4 staggered heat pipes, the single tower cooler enables fast heat transfer into the heatsink, where it can be efficiently dissipated by a 120 mm fan
- A-RGB ILLUMINATION: 12 digital A-RGB LEDs in the fan hub can be controlled autonomously from each other, allowing a completely free choice of color effects, such as the iconic rainbow effect
- FAST AND EASY INSTALLATION: Intel-specific design minimizes unnecessary mounting hardware, greatly simplifying installation. Compatible with Intel 1700, 1200, 115X
- ULTIMATE PERFORMANCE THERMAL PASTE: 0.8 g of the new MX-5 is included for application. This enables a fine application thickness and it isn’t conductive or capacitive – making it simple and absolutely safe to use
- 6-YEAR GUARANTEE: We’re convinced of the quality and longevity of our products, which we are happy to pass on to the customer.
1,685 MAD
ARCTIC Liquid Freezer III 360 A-RGB
1,685 MAD
- CONTACT FRAME FOR INTEL LGA1851 AND LGA1700: Better contact pressure distribution across the Intel mounting frame for efficient heat transfer, thanks to a uniform CPU contact surface
- NATIVE AMD OFFSET MOUNT: Optimized for the multi-die chipset design of Ryzen processors – 5mm offset for optimal CPU hotspot coverage leads to more efficient heat transfer
- ACTIVE COOLING OF VOLTAGE CONVERTERS: PWM-controlled VRM fan that additionally cools base zone components such as voltage converters
- INTEGRATED WIRING MANAGEMENT: The PWM cables for the radiator fans are integrated into the hose lining, meaning there is only one visible cable connected to the motherboard
- LIMITED COMPATIBILITY WITH SOME MOTHERBOARDS: Large heatsinks in the M.2_1 slot may cause compatibility problems. An overview and solution can be found in the technical data, in the manual and on the manufacturer’s website. Please use the compatibility check
1,199 MAD
ARCTIC Liquid Freezer III 240 A-RGB
1,199 MAD
- CONTACT FRAME FOR INTEL LGA1851 AND LGA1700: Better contact pressure distribution across the Intel mounting frame for efficient heat transfer, thanks to a uniform CPU contact surface
- NATIVE AMD OFFSET MOUNT: Optimized for the multi-die chipset design of Ryzen processors – 5mm offset for optimal CPU hotspot coverage leads to more efficient heat transfer
- ACTIVE COOLING OF VOLTAGE CONVERTERS: PWM-controlled VRM fan that additionally cools base zone components such as voltage converters
- INTEGRATED WIRING MANAGEMENT: The PWM cables for the radiator fans are integrated into the hose lining, meaning there is only one visible cable connected to the motherboard
- LIMITED COMPATIBILITY WITH SOME MOTHERBOARDS: Large heatsinks in the M.2_1 slot may cause compatibility problems. An overview and solution can be found in the technical data, in the manual and on the manufacturer’s website. Please use the compatibility check
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